Chaitra, N., C. B. Harshitha, S. Harsha, and A. Jaswal. “Study on the Effect of Substrate Material on the Mechanical Strength of Cu Bonds Bonded through Flip Chip Bonding”. Manufacturing Technology Today, vol. 23, no. 3-4, Mar. 2024, pp. 7-16, doi:10.58368/MTT.23.3-4.2024.7-16.