Naidu, P. Ravi Teja, Vijay Kumar, and Jaspreet Singh. “Low Temperature Anodic Bonding Process With Silicon-Gold-Glass Interface for Wafer Level Packaging Applications”. Manufacturing Technology Today 19, no. 10 (October 1, 2020): 59–63. Accessed May 6, 2025. http://www.mtt.cmti.res.in/index.php/journal/article/view/116.