Resolving fabrication issues in photolithography and thin film deposition
DOI:
https://doi.org/10.58368/MTT.23.3-4.2024.17-23Keywords:
Photoresist, Thin Film Deposition, Electron Beam EvaporationAbstract
This study discusses the issues in two fabrication processes, viz. photolithography and thin film deposition, and their solutions. In the photolithography process using photoresists AZ-10XT and AZ-4562, the issue of bubble formation is observed after UV exposure. This issue was resolved by carefully adjusting the soft-bake parameters to ensure the solvent was completely removed without damaging the photoresist. Similarly, with the thin film deposition of Ti/Au using the electron beam evaporation technique, the issue of poor adhesion of the films was observed in the tape-peel test. It is inferred that the presence of moisture on the substrate is a reason for the poor adhesion of the deposited films. Hence, in-situ pre-deposition heating of the substrate is carried out inside the EBES to remove the moisture adsorbed on the surface of the substrate. The tape-peel test clearly shows that the adhesion quality of deposited films improved after the pre-deposition heating.
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